Product Name :

PCB and FPCB Industry

Product Introduction

拍拍拍无挡视频 www.awtzl.cn Printed circuit board is the carrier of electronic components, and is also the provider that connects the wiring. And is the fundamental in electronic industries. Starting from circuit design, exposure, etching, ink, liquid S/M, and to the finished delicate PCB. Common products are: computer mother board, IC substrate, LED ceramic substrate, FPCBs, and widely used in consumer 3C products, such as notebook, cellular phone, digital camera, and even in the commercial LED display screens. Our tapes provides excellent high temperature and penetration resistant, and also to board’s surface protection.

Product CodeProduct DescriptionPhysical PropertyApplications
GTG225R Silicone Tape Total Thickness 50 um High temperature reflow shelter, finger masking, electrolyte or acid shield, aluminum plate etching acid-shielding, heat system
Backing Thickness 25 um
Adhesion 0.6~0.8 kg/inch
Heat 200℃*30min
GTG250 Silicone Tape Total Thickness 75 um
Backing Thickness 25 um
Adhesion 0.7↑ kg/inch
Heat 200℃*30min
GTG228 Silicone Tape Total Thickness 54 um
Backing Thickness 25 um
Adhesion 0.3↑ kg/inch
Heat 200℃*30min
GTG220 Silicone Tape Total Thickness 44 um
Backing Thickness 25 um
Adhesion 0.5↑ kg/inch
Heat 200℃*30min
GTG275 Silicone Tape Total Thickness 102 um
Backing Thickness 25 um
Adhesion 0.9↑ kg/inch
Heat 200℃*30min
KA105 PISilicone Tape Total Thickness 57 um
Backing Thickness 25 um
Adhesion 0.5↑ kg/inch
Heat 290℃*5min
KA105T PISilicone Tape Total Thickness 63 um
Backing Thickness 25 um
Adhesion 0.55↑ kg/inch
Heat 200℃*2hr
KA104 PISilicone Tape Total Thickness 61 um
Backing Thickness 25 um
Adhesion 0.6↑ kg/inch
Heat 260℃*10min
WCT374 Clean dust sticky tape Total Thickness 68 um Cleanroom sticky dust, clean panel
Backing Thickness 36 um
Adhesion 0.8↓ kg/inch
YTP735 Clean dust sticky tape Total Thickness 90 um
Backing Thickness 72 um
Adhesion 0.3~0.4 kg/inch
YTP745 Clean dust sticky tape Total Thickness 90 um
Backing Thickness 72 um
Adhesion 0.4~0.5 kg/inch
YTP755 Clean dust sticky tape Total Thickness 90 um
Backing Thickness 72 um
Adhesion 0.5~0.6 kg/inch
8JPB418 HAL red tape
(Composites)
Total Thickness 280 um Solder masking protection, high temperature system with fixed
Adhesion 1.0 kg/inch
Temperature 290
8GMT430 Masking tape Total Thickness 140 um Envelope solder, paint masking, masking painting general
Adhesion 0.7↑ kg/inch
Temperature 80
8CMT437 Masking tape Total Thickness 150 um
Adhesion 0.8±0.2 kg/inch
Temperature 150
FPL168 FPC protective film manufacturing process Total Thickness 135 um FPC protective film manufacturing process
Backing Thickness 125 um
Adhesion(On the PI film) 0.03~0.05 kg/inch